Deep Reactive Ion Etching - an overview | ScienceDirect Topics
Wet etching of deep trenches on silicon with three-dimensional (3D) controllability | Semantic Scholar
Micromachines | Free Full-Text | Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE)
Deep Reactive Ion Etching (DRIE) in MEMS - LioniX International
Selective, deep Si trench etching with dimensional control - UNT Digital Library
GaN Deep Trench Etch|Samco Inc.
Micromachines | Free Full-Text | Inductively Coupled Plasma Dry Etching of Silicon Deep Trenches with Extremely Vertical Smooth Sidewalls Used in Micro-Optical Gyroscopes
Project:Twisting Elimination in High Aspect Ratio (HAR) SiO<sub>2</sub> Etching in Fluorocarbon Plasmas---High Energy Electron (HEE) Effects
SiC Trench Plasma Etching for SiC Power Device Fabrication - Samco Inc.
Shallow trench isolation - Wikiwand
Etching, Process to Complete Semiconductor Patterning – 2 | SK hynix Newsroom
Deep Silicon Etching (Trench/Via) using Bosch Process - SAMCO Inc.
Low-temperature smoothing method of scalloped DRIE trench by post-dry etching process based on SF6 plasma | Micro and Nano Systems Letters | Full Text
NMC508DTE Deep Silicon Trench Etch System - Akrion Technologies
trench etching
Silicon Micromachining | SpringerLink
Multilevel deep etching in silicon | nanoFAB
DRIE | Bosch semiconductors for Automotive
Figure 1 from Ultra Deep Reactive Ion Etching of High Aspect-Ratio and Thick Silicon Using a Ramped-Parameter Process | Semantic Scholar
Experimental process of scallop smoothing of DRIE trench by RIE-based... | Download Scientific Diagram
Three step deep reactive ion etch for high density trench etching
Comparison of the Bosch and a Cryogenically Cooled Deep Silicon Etch Processes
High aspect ratio via etching conditions for deep trench of silicon - ScienceDirect
ULTRA-HIGH ASPECT RATIO TRENCHES IN SINGLE CRYSTAL SILICON WITH EPITAXIAL GAP TUNING E. J. Ng*, C.-F. Chiang, Y. Yang, V. A. Hon
Effects of deep reactive ion etching parameters on etching rate and surface morphology in extremely deep silicon etch process with high aspect ratio - Tiantong Xu, Zhi Tao, Hanqing Li, Xiao Tan,